Ceva Wins Next-Generation Bluetooth High Data Throughput and Integrated RF Design Project
author: Hover Technology
2026-05-22
ROCKVILLE, Md. – May 22, 2026 – Ceva, Inc. (NASDAQ: CEVA), a leading licensor of smart edge chip and software IP, today announced that its Bluetooth® High Data Throughput (HDT) solution, which integrates Ceva’s internally developed RF technology, has been selected by a major customer. This significant commercial milestone demonstrates the success of Ceva’s strategy to expand its wireless business.
The customer, a prominent U.S.-based semiconductor company that had previously licensed Ceva’s Bluetooth IP portfolio, has now adopted the Ceva Bluetooth HDT platform, which combines digital baseband, software protocol stack, and Ceva’s own RF technology. The addition of this integrated wireless connectivity subsystem underscores the value Ceva delivers by reducing integration complexity, accelerating time-to-market, and fostering deeper strategic partnerships with customers.
This design win reflects two complementary growth trends. First, multiple customers have ramped production designs based on Bluetooth 6.0, and Ceva has begun to see increasing royalty revenues. Second, Ceva’s early engagement in Bluetooth HDT design projects positions it at the core of next-generation high-performance wireless devices. More integrated platforms mean greater value per collaboration while securing Ceva’s role across multiple product generations on customer platforms.
With billions of Bluetooth-connected devices shipping annually, increasing design complexity is driving demand for more integrated solutions. As the industry shifts toward the physical infrastructure required to support edge AI and data-intensive applications, connectivity becomes a critical layer enabling efficient data transfer, low-latency communication, and seamless device interaction. In this environment, suppliers that can deliver integrated, system-level wireless platforms are becoming increasingly valuable.
By incorporating its own RF technology, Ceva not only strengthens relationships with existing customers but also significantly expands its addressable market. Large system companies and major semiconductor vendors that need complete wireless solutions—but previously lacked a pure-play digital IP offering—can now partner with Ceva as their system-level wireless partner. Meanwhile, customers requiring only digital baseband IP can continue to work with Ceva, allowing the company to address a wide range of wireless design needs.
“Winning this design project for our Bluetooth HDT solution, which includes our integrated RF technology, is a significant milestone for Ceva,” said Amir Panush, Chief Executive Officer of Ceva. “Our continued investment in RF technology, including targeted asset acquisitions, is now translating into customer adoption. This is more than a design win—it validates our strategy of transitioning from component IP to full-stack wireless solutions. We are delivering more complete solutions, creating greater value across the wireless technology stack, and building multi-generational partnerships with industry leaders.”
Andrew Zignani, Senior Research Director at ABI Research, commented: “As Bluetooth technology evolves to support higher data throughput and more advanced use cases, wireless design complexity has increased significantly. Solutions that combine digital baseband, software stacks, and RF are key to reducing integration effort and speeding time-to-market. Ceva’s system-level solution addresses this challenge and is well-positioned to capture a larger share of the next-generation wireless platform market.”
Based on the field-proven Ceva-Waves Links family, this design win and the active Bluetooth HDT evaluation projects in industrial, consumer, and edge AI applications reflect growing demand for complete wireless platforms as part of the broader AI hardware stack. They also underscore the increasing importance of connectivity in enabling next-generation AI-driven devices.
About Ceva
Ceva is a leading licensor of smart edge chip and software IP, enabling smarter, more connected, and secure devices. With a comprehensive portfolio including wireless connectivity, sensing, and edge AI IP, Ceva powers billions of devices worldwide.
Disclaimer
This article contains forward-looking statements that involve risks and uncertainties, including but not limited to the successful integration and commercialization of Ceva’s Bluetooth HDT solution, customer adoption trends, royalty revenue growth, and market demand for integrated wireless platforms. Actual results may differ materially from those anticipated. Ceva undertakes no obligation to update any forward-looking statements. The information herein is based on sources believed to be reliable, but no representation or warranty is made as to its accuracy or completeness.
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